Tech Etch Conductive Foam Gaskets
Low-Compression EMI/RFI Shielding for Electronic Enclosures and I/O Applications
Tech Etch 2700 Series Conductive Foam Gaskets provide effective EMI and RFI shielding in applications that require excellent conductivity without excessive compression force. Their flexible, low-force construction helps establish electrical continuity between mating surfaces while reducing stress on lightweight panels, connector flanges, and sensitive electronic assemblies.
Designed for computer, router, telecommunications, and electronic I/O shielding applications, these gaskets combine open-cell polyurethane foam with conductive nickel-over-copper-plated polyester surfaces. They are available in standard configurations, custom-cut designs, and standard D-connector gasket sizes to support a wide range of enclosure and equipment requirements.

Discover the Features + Benefits | Conductive Foam Gaskets
- Low Compression Force
- Excellent Electrical Conductivity
- Strong EMI/RFI Shielding Performance
- Low Compression Set
- Reduce Electromagnetic Interference
- Protect Sensitive Electronics
- Minimize Panel and Hardware Stress
- Accommodate Surface Irregularities
Tech Etch Conductive Foam Gaskets are well suited for EMI and RFI shielding in:
- Computer equipment
- Routers and network hardware
- Telecommunications systems
- Electronic I/O panels
- Connector interfaces
More Tech Etch Solutions
Metalized Fabric Over Foam Gaskets
- High attenuation shielding using conductive nickel-plated copper nylon ripstop fabric
- Over 150 profiles and sizes available
Vents and Filters
- Cost effective standard rivet
- Installed quickly and easily
- Design of the stem head ensures positive retention
after installation
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